Timothy L. Conlon
Viasystems Group, Inc. (Ret.)
Mr. Conlon was the President and COO of Viasystems, the leading worldwide independent provider of contract electronics manufacturing services, until it sold in 2015. Prior to joining Viasystems, he was the President and COO of Berg Electronics Group, Inc., the world’s third-largest supplier of connector, socket, and cable assembly products serving high-end data processing, personal computing, telecommunications, industrial, and instrumentation markets. Mr. Conlon recently served as Vice Chairman and Director of the China Printed Circuit Association. He earned a BS from Gannon University and an MBA from Saint Bonaventure University.